Grow-your-own approach to wiring 3D chips

时间:2017-11-25 06:01:09166网络整理admin

THE high density of components on “flat” computer chips is encouraging computer engineers to build upwards and create three-dimensional versions. A method for growing 3D wires in situ could help link up the “storeys”. Min-Feng Yu and Jie Hu at the University of Illinois at Urbana-Champaign have adapted a form of electroplating, in which a current is used to coat a conductive surface with a layer of metal, deposited from a liquid electrolyte. Yu and Hu placed the electrolyte in a pipette held above the conductive surface. When an electrical potential is applied between the two,